Samsung Electronics and AMD collaborate to enhance semiconductor testing infrastructure by integrating Zen 6-based EPYC Embedded processors with advanced DDR5, SSD and CXL memory technologies.
Samsung Electronics and US-based semiconductor company AMD are collaborating to upgrade semiconductor manufacturing test infrastructure by combining AMD's latest high-performance embedded processors with Samsung's advanced memory and storage technologies. Announced on November 11, 2026, the partnership aims to improve computing performance, memory bandwidth and high-speed data processing capabilities required for testing next-generation semiconductor products.
The collaboration will integrate AMD's sixth-generation EPYC Embedded 9006 Series processors with Samsung's DDR5 memory modules, next-generation solid-state drives (SSDs) and Compute Express Link (CXL)-based memory solutions. The combined technologies are expected to strengthen semiconductor testing environments that handle increasingly complex memory and storage devices.
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Samsung's solutions for the collaboration include DDR5 Registered DIMMs (RDIMMs) and Multi-Rank DIMMs (MRDIMMs), designed to support high-speed data processing. The portfolio also includes the PM1763 SSD, based on the sixth-generation PCIe interface, and the CMM-D MD310 memory expansion solution built on CXL 3.2 technology. These products are designed to address growing bandwidth and data-transfer requirements in advanced computing environments.
AMD's EPYC Embedded 9006 Series is built on the company's Zen 6 architecture and supports up to 256 cores and 512 threads. The processors deliver up to 1.8 times the throughput of the previous-generation EPYC 9005 Series. Their input/output bandwidth has increased by up to 1.5 times, while memory bandwidth has improved by up to 2.7 times compared with the previous generation.
The processors are designed for industrial applications requiring high-performance computing and large-scale data processing. Key applications include automated test equipment (ATE) for semiconductor manufacturing, enterprise storage systems and network security infrastructure. In semiconductor testing environments, the processors can manage memory and storage-device testing operations while enabling multiple tests to run simultaneously.
Choi Jang-seok, an executive in Samsung Electronics' Memory Business Division, said manufacturing test environments must evolve alongside improvements in memory and input/output technologies. He highlighted the importance of combining AMD's processing capabilities with Samsung's memory and storage solutions to deliver scalable computing performance and higher bandwidth.
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AMD plans to begin shipping the 128-core model of the EPYC Embedded 9006 Series on November 15, 2026, with the remaining models scheduled for sequential delivery through the end of the year.
The partnership reflects growing demand for advanced semiconductor testing infrastructure as memory technologies, storage devices and high-performance computing systems become more sophisticated. By integrating processing, memory and storage capabilities, Samsung and AMD aim to strengthen the performance and scalability of semiconductor manufacturing test systems.